GB/T 43136-2023 (English Version)

Standard No.: GB/T 43136-2023
Language: Chinese, Available in English version
Release Date: 2023
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 43136-2023

Scope: This document specifies the product classification, product marking, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of grinding wheels for precision dicing of semiconductor chips. This document is applicable to electroplated bond, resin bond and metal bond diamond grinding wheels for precision dicing of semiconductor wafer chips and precision cutting of package chips.

Introduction

GB/T 43136-2023 Standard Overview

GB/T 43136-2023 "Superhard abrasive products - grinding wheels for precision dicing of semiconductor chips" is a standard developed for the precision processing needs of superhard abrasive products in the semiconductor industry. This standard specifies the product classification, technical requirements, test methods and inspection rules for grinding wheels for precision dicing of semiconductor chips, and is applicable to electroplated bond, resin bond and metal bond diamond grinding wheels for precision dicing of wafer chips and precision cutting of package chips.

Product Classification and Labeling

Category	Product Code	Binder Type	Shape Code
Grinding Wheel for Precision Slicing of Wafer Chips	SWDW	Electroplating Binder	3A2 (Hub Type)
Grinding Wheel for Precision Cutting of Package Chips	SPCW	Resin Binder, Metal Binder, Electroplating Binder	1A8, 1B8, 1D8, 1E8 (Hubless Type)

Technical Requirements Analysis

The technical requirements for grinding wheels in this standard include appearance, basic size limit deviation, form and position tolerance and substrate roughness. The following is a comparison of key indicators:

Technical requirements	Grinding wheel for precision wafer chip slicing	Grinding wheel for precision package chip cutting
Limit deviation of abrasive layer thickness	When U≤40 μm, -5 μm	When T or T2≤0.15 mm, ±0.005 mm
Limit deviation of effective abrasive layer depth	+130 μm	+0.2 mm
Substrate roughness	Ra≤1.6 μm	Ra≤1.6 μm

Test methods and inspection rules

The standard specifies strict test methods and inspection rules, including appearance inspection, dimensional measurement and geometric tolerance inspection. Here are some key inspection requirements:

Outer diameter measurement: Use an image measuring instrument with a resolution of 0.01 mm.
Aperture measurement: The aperture of 3A2 grinding wheel is measured with a pneumatic measuring instrument, and other models are measured with a plug gauge or an inner diameter indicator.
Flatness inspection: Use a feeler gauge to measure the gap between the grinding wheel and the marble platform.

Background of Standard Formulation and Technological Evolution

With the development of the semiconductor industry, the requirements for chip processing accuracy are constantly increasing, and the application of superhard abrasive products is becoming more and more extensive. The formulation of this standard reflects the industry's demand for high-precision, high-performance grinding wheels, and embodies the technological upgrade from traditional grinding to precision machining.

Implementation Recommendations

To ensure the effective implementation of the standard, the following measures are recommended:

Enterprises should establish a sound quality management system and strictly carry out production and inspection in accordance with the standards.
Strengthen employee training, especially the operating specifications of newly introduced test methods and testing equipment.
It is recommended to use standardized instruments (such as pneumatic measuring instruments and tool microscopes) to ensure measurement accuracy.

GB/T 43136-2023 Referenced Document

GB/T 16458 Terminology for abrasives and abrasive products
GB/T 1800.2-2020 Geometrical product specifications (GPS)—ISO code system for tolerances on linear sizes—Part 2: Tables of standard tolerance classes and limit deviations for holes and shafts
GB/T 2829 Sampling procedures and tables for periodic inspection by attributes (Apply to inspection of process stability)

GB/T 43136-2023 history

2023 GB/T 43136-2023 Superabrasive products: grinding wheels for precision scribing of semiconductor chips