GB/T 5489-2018

Printed circuit board draw (English Version)

GB/T 5489-2018
Standard No.
GB/T 5489-2018
Language
Chinese, Available in English version
Release Date
2018
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 5489-2018
Replace
GB/T 5489-1985
Scope
This standard specifies the drawing of printed board drawings and printed board assembly drawings (hereinafter referred to as printed board assembly drawings). This standard is applicable to the drawing of orthographic projections and symbol drawings of printed board drawings and printed board assembly drawings that use dimension line method and grid method to mark dimensions. It can be used as a reference when using automatic CAD to draw printed board drawings.
Introduction

In-depth interpretation of GB/T 5489—2018 Printed Circuit Board Drawing Standard

Standard Dimensions Technical Requirements Implementation Suggestions Comparative Analysis
Annotation Method The dimension line method, grid method and hybrid method are used in combination to ensure the accuracy and clarity of dimensioning. The dimension line method is preferred, the grid method is used for complex structures, and the hybrid method is suitable for multi-layer board design. Compared with the old standard, the specific requirements of the grid method and hybrid method are added, and the annotation flexibility is significantly improved.
Conductive graphics Draw with double-line outline or coloring method, and indicate the dimension data such as wire width and spacing; large-area conductive areas and isolation areas need to be specially marked. Choose the appropriate drawing method according to the complexity of the board layer; ensure that the marking of key dimensions meets the manufacturing tolerance requirements. New requirements for the inner isolation area and isolation plate of multi-layer boards have been added, further improving the standardization of graphic drawing.
Solder mask graphics The size of the solder mask pad needs to consider parameters such as aperture and ring width; the shape of the pad is selected according to the wiring density to ensure that the risk of short circuit is avoided. High-density design gives priority to round or square pads; special-shaped holes and special packaging devices require customized processing. The simple solder mask pattern in the old standard has been refined, and a variety of shapes and calculation formulas have been added to meet the needs of modern manufacturing.

Explanation of professional terms and practical application cases

Grid Method: Dimensioning is done by using rectangular coordinates or polar coordinates, which is suitable for dimensioning complex printed circuit board graphics. For example, in multi-layer board design, the grid method can more clearly express the relative position relationship between layers.

Solder Mask Pattern: A key structure used to prevent short circuits between wires. In practical applications, high-density wiring areas usually use cut circular or elliptical pads to optimize space utilization and reduce welding risks.

Via Position Drawing: A drawing method that includes circular holes and special-shaped holes. For example, in drilling manufacturing, special-shaped holes need to be accurately marked with six parameter values to ensure processing accuracy and position accuracy.

Implementation suggestions

1. Design stage:

  • Preferentially use automatic CAD tools for drawing to ensure the overlap accuracy of each layer of graphics.
  • Choose the appropriate marking method (dimension line method, grid method or mixed method) according to the number of layers and complexity of the board.
  • Use fine marking in high-density areas to avoid conductive graphics covering character graphics.

2. Manufacturing stage:

  • Strictly follow the standard requirements for drilling and solder mask processes to ensure that parameters such as hole diameter and ring width meet the design requirements.
  • Check the multi-layer board layer by layer to ensure that the dimensions of the isolation area and isolation plate are accurate.
  • Use optical positioning marks to ensure the accuracy of surface mounted components.

3. Inspection stage:

  • Focus on checking the hole pattern and solder mask pattern to ensure that the hole diameter classification is clear and the solder mask film is fully covered.
  • Use professional testing equipment to verify whether the minimum spacing of the conductive pattern and the distance of the isolation area meet the requirements.

GB/T 5489-2018 Referenced Document

GB/T 5489-2018 history



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