GB/T 23611-2023 (English Version)

Standard No.: GB/T 23611-2023
Language: Chinese, Available in English version
Release Date: 2023
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 23611-2023
Replace: GB/T 23611-2009

Scope: This document specifies the product classification, technical requirements, test methods, inspection rules and marking, packaging, transportation, storage, accompanying documents and order form contents of gold and gold alloy targets. This document is applicable to gold and gold alloy targets for semiconductor electronic devices (hereinafter referred to as "targets").

Introduction

1. Standard Overview

This standard (GB/T 23611-2023) is issued by the State Administration for Market Regulation and the National Administration of Standardization, replacing the previous GB/T 23611-2009. This standard is mainly applicable to the classification, technical requirements, test methods, etc. of gold and gold alloy targets for semiconductor electronic devices.

2. Comparison of standard frameworks

Dimensions	New standard GB/T 23611—2023	Old standard GB/T 23611—2009
Classification method	Added AuGe and AuGeNi alloy target varieties; divided into round and rectangular according to shape; divided into single and welded according to structure	AuGe and AuGeNi alloy targets are not included; the classification is relatively simple
Technical requirements	Added detailed requirements such as chemical composition, grain size, and welding quality	Mainly stipulates chemical composition and shape size requirements
Test Methods	New analysis methods for AuGe and AuGeNi alloy targets have been added, and more advanced detection technologies have been introduced	The test methods are relatively basic

3. Recommendations for Standard Implementation

3.1 Recommendations for Target Selection

IC-Au99.99 and IC-Au99.999 are suitable for scenarios with high purity requirements, such as high-end semiconductor manufacturing
For applications that require high temperature resistance and oxidation resistance, it is recommended to select AuGe alloy targets
Under complex structure requirements, IC-Au99.999 targets are preferred. class='instrument'>AuGeNi alloy target

3.2 Key points of quality control

Chemical composition detection: Strictly follow the provisions of Table 1 and Table 2 to ensure that the impurity content meets the requirements
Grain size control: It is recommended to use the GB/T 6394 method to ensure that the average grain size does not exceed 100μm
Welding quality inspection: Use the YS/T 837 standard to ensure that the bonding rate is not less than 95%

3.3 Packaging and storage recommendations

Use double-layer anti-static plastic bags for vacuum packaging to ensure that the product is free of oxidation and physical damage
The storage environment should be kept clean and dry, and avoid high temperature and high humidity
Use professional packaging boxes during transportation to prevent collision and contamination

GB/T 23611-2023 Referenced Document

GB/T 11066.1 Methods for chemical analysis of gold.Determination of gold content.Fire assaying method
GB/T 11066.10 Methods for chemical analysis of gold.Determination of silicon content.Molybdenum blue spectrophotometry
GB/T 11066.11 Methods for chemical analysis of gold—Part 11：Determination of magnesium, chromium,manganese,iron,nickel,copper,palladium,silver,tin,antimony,lead and bismuth contents—Inductively coupled plasma mass spectrometry
GB/T 15077 Geometric size measuring methods of precious metals and their alloy materials
GB/T 6394 Determination of estimating the average grain size of metal
GB/T 8651 Flaw detection method by the ultrasonic plate wave for metal plates
YS/T 837 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies

GB/T 23611-2023 history

2023 GB/T 23611-2023 Gold and Gold Alloy Targets
2009 GB/T 23611-2009 Gold target