GB/T 42895-2023 (English Version)

Standard No.: GB/T 42895-2023
Language: Chinese, Available in English version
Release Date: 2023
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 42895-2023

Scope: This document describes the requirements and test methods for in-situ testing of the bending strength of microstructures involved in silicon-based MEMS processing. This document is applicable to the bending strength testing of microstructures manufactured using microelectronics technology.

Introduction

1. Background and significance of standard formulation

With the rapid development of micro-electromechanical systems (MEMS) technology, silicon-based MEMS microstructures are increasingly used in various electronic devices. In order to ensure the reliability and performance stability of microstructures, GB/T 42895-2023 standard came into being. This standard aims to provide unified methods and requirements for the bending strength test of silicon-based MEMS microstructures, and provide an important basis for the quality control and research and development of MEMS devices.

2. Comparative analysis of standard frameworks

Standard dimensions	GB/T 42895—2023	Comparative standard (GB/T 26111)	Technical advantages
Scope of application	Silicon-based MEMS microstructure bending strength test	General standard for MEMS technical terms	Focus more on specific microstructure mechanical properties testing
Core content	Design and preparation requirements for in-situ on-chip test machines	MEMS term definitions	New requirements for special test methods and equipment
Technical indicators	Deformation scale resolution, elastic beam strength, etc.	No specific mechanical performance indicators	Provide quantitative test standards

3. Standard implementation suggestions

3.1 Implementation steps

Equipment preparation: Ensure that the test equipment and wafer processing equipment meet the standard requirements.
Structure design: Design the test structure according to Appendix A and Table A.2.
Environmental control: Complete the test in the MEMS manufacturing environment.
Data acquisition: Use an optical microscope to observe the deformation and record the readings.

3.2 Application Examples

For example, when designing a MEMS gyroscope, the bending strength of its key microstructure can be tested according to this standard to ensure its durability and reliability in practical applications.

GB/T 42895-2023 Referenced Document

GB/T 26111 Micro-Electro-Mechanical Systems (MEMS) Technical Terminology
GB/T 34558 Terminology for metal matrix composites

GB/T 42895-2023 history

2023 GB/T 42895-2023 Bending strength test method of microelectromechanical system (MEMS) technology silicon-based MEMS microstructure